South Edition: Tube & Pipe Fair 2026 Is Bigger, Better and Even More Business Focused!
2026-05-07 Tube & Pipe Fair 2026
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South Edition: Tube & Pipe Fair 2026 Is Bigger, Better and Even More Business Focused!
2026-05-07 Tube & Pipe Fair 2026

SK Group signs MOUs to advance Vietnam’s AI ecosystem and infrastructure development
SK Group will collaborate with Vietnam to develop the country’s AI ecosystem and infrastructure.
2026-05-06 SK Group

TSMC launches A13 process and advanced technologies
A13 maintains full backward compatibility with A14 design rules, enabling faster customer migration to the company’s nanosheet transistor architecture.
2026-05-06 Taiwan Semiconductor Manufacturing Co. Ltd (TSMC)

ATLANT 3D and NUS partner on AI-driven materials discovery foundry in Singapore
ATLANT 3D and NUS I-FIM are collaborating to build AI-driven, atomic-scale materials discovery foundry in Singapore.
2026-05-06 ATLANT 3D

Southeast Asia emerges as global data center hotspot as market set to hit US$14B by 2034
The Southeast Asia data center market is forecast to grow to US$14 billion by 2034, driven by cloud adoption amid exploding AI demand.
2026-05-06 IMARC Group

AI Chip boom powers double-digit growth in global electronic system design industry
ESD industry revenue increased by 10.3% year-on-year to $5.47 billion in the fourth quarter of 2025, according to the ESD Alliance.
2026-05-06 SEMI

AI infrastructure boom fuels rapid growth of the ‘Foundry 2.0’ semiconductor ecosystem
The broadly defined Foundry 2.0 market is projected to surpass $360 billion in 2026, representing 17% YoY growth, according to IDC.
2026-05-06 International Data Corp.

Polyn Technology drives ultra-low-power automotive ai forward with neuromorphic chip tapeout
Polyn Technology has taped out a VibroSense engineering chip featuring an analog neuromorphic core for tire friction monitoring.
2026-05-06 Polyn Technology

JEDEC pushes DDR5 memory performance to new heights with next-generation MRDIMM standards
The new DDR5 MRDIMM memory logic standards enable higher bandwidth scaling while JEDEC progresses next‑generation MRDIMM module designs.
2026-05-06 JEDEC Solid State Technology Association

GUC powers the next wave of AI Computing with advanced ASIC and chiplet technologies
Collaboration brings together flagship SoC design, optical I/O and rack-scale liquid-cooled system integration to help hyperscalers accelerate system-ready AI infrastructure.
2026-05-06 Global Unichip Corp. (GUC)

Arrow Electronics accelerates shift toward software-defined vehicles with new E/E architecture initiative
Arrow Electronics is positioning itself as a key enabler of next-generation mobility.
2026-05-06 Arrow Electronics

Analog Devices expands semiconductor manufacturing network with new Thailand facility
Thailand plays a critical role in ADI's global manufacturing network, supporting long‑term growth by expanding the company's footprint with the resilience, flexibility and scale needed to serve customers across several markets.
2026-05-06
Sandvik Coromant Indonesia presents latest machining solutions to Indonesian manufacturers
Rising demand for industrial data transparency
EuroBLECH 2026 unveils innovation zone to spotlight the future of advanced manufacturing
Modern AI applications
2026-05-08
China is shaping the future, while Europe struggles with the past
2026-05-08
Debut and Oterra to develop and scale biotech alternative to Red 40 for food and beverage
2026-05-07
SK Group signs MOUs to advance Vietnam’s AI ecosystem and infrastructure development
2026-05-06
ATLANT 3D and NUS partner on AI-driven materials discovery foundry in Singapore
2026-05-06