K-beauty brand secures USDA plant variety protection

RIMAN’s Giant BYoungPool™, a plant whose active compounds are used in skincare products, has been granted 20-year Plant Variety Protection (PVP) by the US Department of Agriculture.

Expanding global manufacturing base for flexible packaging

Sandeep Dutta, President North America of Cosmo Films, explains about the expansion at the Chicago facility and how this strategically positioned site serves the North American markets.

Machines will think along with us in the future

AI took center stage at EMO Hannover 2025, showing its real-world impact on machine tools and manufacturing. No longer experimental, AI is now key to smarter production, efficient maintenance, and adapting to skills shortages—emerging as a vital strategy for industry survival.

Advancing sustainable packaging for a circular economy

At the 2025 ASEAN Manufacturing Summit, Mr. Jeffri Ricardo, Senior Manager of Public Affairs & Sustainability of Danone Indonesia will present how AQUA has been true to its commitment to achieve a circular economy

Kerry showcased next-generation food innovation at Fi Asia 2025

With the theme Reformulate for Impact, Kerry aimed to inspire the Future of sustainable nutrition

Stora Enso unveils consumer board production line in Finland – largest in Europe

Stora Enzo consumer packaging board production line in Oulu, Finland is expected to reach its full capacity of 750,000 tonnes by 2027, when its annual sales are anticipated to be approximately EUR 800 million.

New concept on sustainability to be presented at ASEAN Manufacturing Summit

Ms. Deva Dharmapuspa, SC, QHSE, Material Innovation Business Unit Head of Dynapack Asia, will focus on “Three Green Circles” and how this concept can spearhead the drive toward sustainability.

Driving manufacturing progress

With rising material costs, growing pressure to reduce lead times and increasing complexity in machining processes, manufacturers are seeking smarter, more holistic approaches to improvement.

EV Group unveils high-throughput D2W metrology for chiplet and 3D integration

EVG's EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield.

Renesas launches ultra-low-power MCU with advanced security for smart devices

Renesas' RA4C1 offers ultra-low power consumption, advanced security features, abundant communication interfaces, and segment LCD support.

Top 5 wafer fab equipment leaders surge 20% in 2Q 2025

The top five chip fab equipment manufacturers' revenue grew by 20% YoY in 2Q 2025, driven by strong momentum in leading-edge processes, strong HBM and advanced packaging demand.

Clextral: A vision for smart, scalable snacking and food solutions in Asia

Camille Challard, Director Asia Pacific at Clextral, on leading the company’s growth in Asia Pacific