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Johnnie Walker unveils lightest whiskey glass bottle

Johnnie Walker unveils lightest whiskey glass bottle

Johnnie Walker's design project on glass lightweighting presents a vision of future bottles – they are lightweight, have a low carbon footprint, but still luxurious. It demonstrates what is possible when it comes to lightweighting glass.

Food & BeveragePackaging Equipment & Materials Brewing

2024-09-18 Johnnie Walker

Health claims likely to influence younger consumers, says Prinova

Health claims likely to influence younger consumers, says Prinova

Health claims impact the purchasing decisions of most consumers regarding food and beverages, with the greatest influence observed among younger demographics, according to research findings.

Food & BeverageFood & Beverage Ingredients Market TrendsIngredients

2024-09-18 Prinova Europe

Health-conscious consumerism drives industry support for alcohol labeling

Health-conscious consumerism drives industry support for alcohol labeling

GlobalData reports that 71% of Australian consumers consider low-calorie and low-cholesterol options as essential or desirable factors when selecting food and drink products.

Food & BeverageBeverage Processing & Equipment Brewing

2024-09-18 GlobalData

Bio-circular polypropylene for food industries

Bio-circular polypropylene for food industries

Braskem America introduces Bio-Circular Polypropylene (PP), a sustainable solution for the restaurant and snack food industries

Plastics & RubberPlastics Recycling PackagingProcessing

2024-09-18 Braskem

Innovative solutions with a focus on customer benefits

Innovative solutions with a focus on customer benefits

ENGEL showcases different sustainable and smart solutions and encourages visitors to check their exhibit

Plastics & RubberPlastics Recycling Tradeshow Preview/ReviewSupplier Updates

2024-09-18

CELUS, Renesas partner to advance innovation in electronics design

CELUS, Renesas partner to advance innovation in electronics design

CELUS has integrated cutting-edge solutions and reference designs by Renesas into the CELUS Design Platform's expansive database.

Semiconductor / Electronic Chip

2024-09-18 CELUS

New SK hynix SSDs double performance for data centers

New SK hynix SSDs double performance for data centers

SK hynix's latest SSD features improved data processing speed and power efficiency by applying Gen5 PCIe specifications.

Semiconductor / Electronic Chip

2024-09-18 SK hynix

Global smartphone production to slightly rebound in 3Q 2024

Global smartphone production to slightly rebound in 3Q 2024

Global smartphone production is anticipated to see a modest QoQ increase to 293 million units in the third quarter, according to Trendforce.

Semiconductor / Electronic ChipElectronics Manufacturing Services (EMS)/System Integration Electronic chip packaging and teElectronic chip manufacturing

2024-09-18 Trendforce

Infineon introduces the world's first 300mm power GaN technology

Infineon introduces the world's first 300mm power GaN technology

Infineon is the first company in the world to master this groundbreaking technology in an existing and scalable high-volume manufacturing environment. The breakthrough will help substantially drive the market for GaN-based power semiconductors.

Semiconductor / Electronic ChipSemiconductor Process Equipment

2024-09-18 Infineon

Keysight unveils 14-bit precision oscilloscope with 4x enhanced signal resolution

Keysight unveils 14-bit precision oscilloscope with 4x enhanced signal resolution

Keysight's InfiniiVision HD3 Series ADC oscilloscope delivers four times the signal resolution and half the noise floor of other general-purpose oscilloscopes.

Semiconductor / Electronic Chip Electronic chip manufacturing

2024-09-18 Keysight

AMOLED displays poised to dominate the smartphone market

AMOLED displays poised to dominate the smartphone market

Global shipments of AMOLED smartphone panels are anticipated to surpass 840 million units in 2024, according to TrendForce.

Semiconductor / Electronic ChipElectronics Manufacturing Services (EMS)/System Integration Electronic chip design

2024-09-18 TrendForce

IP technology powers unmatched bandwidth for high-speed die-to-die connectivity

IP technology powers unmatched bandwidth for high-speed die-to-die connectivity

Synopsys' complete UCIe IP solution addresses the increased compute performance requirements of the world's fastest AI data centers.

Semiconductor / Electronic ChipIntellectual Property (IP) based Electronic Design Automation (EDA) software Electronic chip manufacturing

2024-09-18 Synopsys