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YIZUMI awarded A-Grade Reliability Certificate, a sector first

YIZUMI awarded A-Grade Reliability Certificate, a sector first

YIZUMI was awarded Mechanical Industry Reliability Management System Evaluation Certificate (Grade A), making it the first equipment enterprise in China to receive a certificate for building a reliability management system driven by both "technology and system".

Plastics & RubberPlastics Machinery Enterprise CloseupTechnology Features

2024-12-30 Yizumi

Metal organic framework and PCP from waste PET bottle

Metal organic framework and PCP from waste PET bottle

Green Science Alliance produced MOF (Metal Organic Framework), PCP (Porous Coordination Polymer) from waste PET bottle

Plastics & RubberPlastics Recycling Supplier UpdatesIndustry Focus

2024-12-27 Green Science Alliance Co., Ltd.

Collaboration for the acceleration of new materials discovery and innovation

Collaboration for the acceleration of new materials discovery and innovation

CAS and PetroChina Shanghai Advanced Materials Research Institute announce a collaboration to accelerate new materials discovery and innovation

Plastics & Rubber Supplier UpdatesIndustry Focus

2024-12-27 CAS

AI and cyber security dominate ASEAN enterprises' digital priorities

AI and cyber security dominate ASEAN enterprises' digital priorities

Investments in AI surge, but challenges in data quality and cyber security readiness persists

Semiconductor / Electronic Chip AutomationSoftware & Control

2024-12-27 ASEAN Innovation Business Platform

Global semiconductor equipment billings up 19% YoY in 3Q 2024

Global semiconductor equipment billings up 19% YoY in 3Q 2024

SEMI just reported in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report that global semiconductor equipment billings rose by 19% year-over-year to $30.38 billion in Q3 2024 while quarter-over-quarter billings registered a 13% growth during the same period.

Semiconductor / Electronic ChipSemiconductor Process Equipment

2024-12-27

SP Manufacturing expands with New Malaysia plant

SP Manufacturing expands with New Malaysia plant

SP Manufacturing (SPM), a leader in Electronic Manufacturing Services (EMS), is strengthening its global presence with two major moves: opening a new manufacturing facility in Senai, Malaysia, and successfully acquiring the Asian operations of the Ideal Jacobs Corporation.

Semiconductor / Electronic ChipSemiconductor Process Materials/Gases/Chemicals

2024-12-27 SP Manufacturing

Thailand BOI greenlights Foxsemicon subsidiary investment in high-precision semicon machinery parts

Thailand BOI greenlights Foxsemicon subsidiary investment in high-precision semicon machinery parts

The Thailand Board of Investment (BOI) today announced it has granted investment privileges to a 10.5 billion baht (ca. US$ 306 million) investment by UNIQUE Integrated Technology Co., Ltd., a subsidiary of Foxsemicon Integrated Technology Inc. (Fiti Group), to build a factory to produce for export high-precision machinery parts and equipment used in the semiconductor industry.

Semiconductor / Electronic Chip

2024-12-27 Thailand Board of Investment (BOI)

SignOff Semiconductors expands global presence with new Office in Penang

SignOff Semiconductors expands global presence with new Office in Penang

SignOff Semiconductors Pvt. Ltd., headquartered in Bengaluru, India, and a leading provider of VLSI and Embedded Design services, is thrilled to announce the opening of its new office in Penang, Malaysia.

Semiconductor / Electronic Chip

2024-12-27 SignOff Semiconductors Pvt. Ltd

Advanced processes, China policy propel global foundry revenue to new heights in 3Q24

Advanced processes, China policy propel global foundry revenue to new heights in 3Q24

According to TrendForce’s latest report, while the overall economic situation did not significantly improve in the third quarter of 2024.

Semiconductor / Electronic ChipSemiconductor Process Materials/Gases/Chemicals

2024-12-27 TrendForce’s

WiMi develops FPGA-based digital quantum computer verification technology

WiMi develops FPGA-based digital quantum computer verification technology

WiMi Hologram Cloud Inc., a leading global Hologram Augmented Reality Technology provider, today announced that their R&D team has developed a revolutionary technology — FPGA-based digital quantum computer verification technology.

Semiconductor / Electronic ChipIntellectual Property (IP) based Electronic Design Automation (EDA) software

2024-12-27 WiMi Hologram Cloud Inc.

Quobly teams up with STMicroelectronics to boost quantum processor production

Quobly teams up with STMicroelectronics to boost quantum processor production

Collaboration will leverage ST's 28nm FD-SOI commercial semiconductor volume manufacturing processes to pave the way towards cost-competitive, large-scale quantum computing solutions.

2024-12-27 Quobly

UMC signs 30-year deal with CIP for 30 billion kWh of renewable energy

UMC signs 30-year deal with CIP for 30 billion kWh of renewable energy

The agreement will help UMC achieve its goal of 50% renewable energy use by 2030 as part of its net zero roadmap.

Semiconductor / Electronic Chip

2024-12-27 United Microelectronics Corporation