79% spike in recorded food supply chain thefts in 2024

Most sectors experienced a spike in thefts in 2024 as geopolitical uncertainty, weather, inflationary pressures drive new practices in fraud, according to BSI Consulting.

Dow announces strategic investment in advanced recycler Xycle

This marks a new milestone in Dow’s ongoing commitment to transform plastic waste into high-value materials and accelerate a circular economy for plastics by further increasing and diversifying access to circular feedstock.

Brenntag Specialties and Syensqo renew distribution partnership for aroma products

Expanding market reach and strengthening regional partnerships to serve the food and nutrition markets with high-quality and sustainable aroma products

Plastic additives sales to grow by 3.3% annually until 2023

Ceresana estimates that 36.7 million tons of plastic additives are consumed worldwide each year, growing by an average of 3.3% until 2033.

North American Plastics Industry Leaders stress importance of trade

The importance of trade for manufacturing growth and economic stability across the continent being stressed by North American Plastics Industry Leaders in a statement.

SignOff Semiconductors reveals expansion plans in Penang

SignOff Semiconductors Pvt. Ltd., headquartered in Bengaluru, India, and a leading provider of VLSI and Embedded Design services, is thrilled to announce the opening of its new office in Penang, Malaysia

Southeast Asia’s smartphone shipments up 11% in 2024 as OPPO takes lead for first time

Canalys’ latest research reveals that Southeast Asia’s smartphone market rebounded in 2024, with vendors shipping 96.7 million units – up 11% year on year after two years of decline. OPPO led the market for the first time, capturing an 18% share with 16.9 million shipments, marking a 14% annual increase.

Infineon partners with TSRI to drive innovation ecosystem in Thailand

Infineon and Thailand Science Research and Innovation (TSRI) have signed an MoU to strengthen the semiconductor ecosystem in Thailand

Micron building new HBM advanced packaging factory in Singapore

Micron's new HBM advanced packaging facility will be the first facility of its kind in Singapore.

Telink Semiconductor unveils ML and AI TL-EdgeAI Platform

Telink Semiconductor has launched a new generation of highly integrated chips as well as an ML and AI platform based on these devices.

Microchip MPLAB compiler licenses simplify software management

Microchip's unified system accommodates evolving development needs and offers multiple tiers to suit growing teams.

imec achieves electrical yield for 20nm pitch metal lines with High-NA EUV single patterning

imec has presented the first electrical test results obtained on 20nm pitch metal line structures patterned after single-exposure High NA EUV lithography.