iConnectHub

Login/Register

WeChat

For more information, follow us on WeChat

Connect

For more information, contact us on WeChat

Email

You can contact us info@ringiertrade.com

Phone

Contact Us

86-21 6289-5533 x 269

Suggestions or Comments

86-20 2885 5256

Top

All Categories

Please select

 

Please select

Search

All

Editor's Pick

Latest

Global

Technical center for injection molding machine

Technical center for injection molding machine

ENGEL presents the largest technical center injection molding machine

Plastics & Rubber Supplier UpdatesIndustry Focus

2024-07-18 ENGEL

Flexicon marks 50 years

Flexicon marks 50 years

Flexicon Corporation, a privately-held firm and world leader in bulk handling equipment and systems, is commemorating its 50th anniversary in 2024

Food & BeverageFood Processing & Equipment ProcessingIndustry Updates

2024-07-18 Flexicon

Top 4 crumbs for meat and meat alternatives

Top 4 crumbs for meat and meat alternatives

Coatings, whether applied to meat or plant-based proteins, play a crucial role in the production of prepared foods.

Food & BeverageFood Processing & Equipment ProcessingQuality & Safety

2024-07-18 Heat and Control

Mogul technology for confectionery processing

Mogul technology for confectionery processing

From gummy bears to sugar-coated pralines, Winkler und Dünnebier Süßwarenmaschinen GmbH (WDS) provides solutions for every possible jelly product.

Food & BeverageFood Processing & Equipment Processing

2024-07-18 Winkler und Dünnebier Süßwarenmaschinen GmbH (WDS)

FDA confirms Arla Foods Ingredients’ whey protein hydrolysates can be used in infant formula

FDA confirms Arla Foods Ingredients’ whey protein hydrolysates can be used in infant formula

The US Food & Drug Administration has approved the use of Arla Foods Ingredients' whey protein hydrolysates that support allergy management and gut comfort in infant formula.

Food & BeverageFood & Beverage Ingredients Ingredients/Formulation

2024-07-18 Arla Foods Ingredients

Latest market research report for global vacuum packaging market 2024-2028

Latest market research report for global vacuum packaging market 2024-2028

According to Technavio, the Vacuum Packaging Market size is set to grow by USD 7.93 billion from 2024-2028 due to increasing awareness about food safety and hygiene

Plastics & Rubber PackagingIndustry Focus

2024-07-17 Technavio

Sidel delivers C’estbon Beverage’s expansion into large water bottle formats

Sidel delivers C’estbon Beverage’s expansion into large water bottle formats

China Resources C’estbon Beverage Co. Ltd has chosen Sidel's innovative complete line packaging solution to help deliver its expansion in big format water production

Food & BeveragePackaging Equipment & Materials PackagingIndustry Updates

2024-07-17

Revolutionary solutions for enhancing the efficiency of robotic arms

Revolutionary solutions for enhancing the efficiency of robotic arms

In modern automation and precision manufacturing, the stability and efficiency of robotic arms (both humanoid and industrial) are crucial. As fundamental components in circuits, capacitors play a vital role in the performance of robotic arms.

Semiconductor / Electronic ChipIntellectual Property (IP) based Electronic Design Automation (EDA) software Smart FactoryElectronic chip manufacturing

2024-07-16 YMIN CAPACITOR

SiC wafer cutting speed up to 100 times faster than dicing

SiC wafer cutting speed up to 100 times faster than dicing

New Process to Revolutionize SiC Wafer Cutting “Common Sense of Glass Processing” to Challenge Semiconductor Market

Semiconductor / Electronic ChipSemiconductor Process Equipment Electronic chip packaging and te

2024-07-16 Mitsuboshi Diamond Industries

The key to agile and secure Industry 4.0 advancements

The key to agile and secure Industry 4.0 advancements

FPGAs are quickly becoming the tool of choice for developers to meet these demands and keep pace with the Industry 4.0 revolution.

Semiconductor / Electronic Chip Electronic chip packaging and teElectronic chip design

2024-07-16 Lattice Semiconductor

AEM intros automated burn-in systems for AI, HPC chip testing

AEM intros automated burn-in systems for AI, HPC chip testing

AMPS-BI performs accelerated high voltage stress testing on advanced semiconductor devices such as AI processors and HPC units.

Semiconductor / Electronic ChipSemiconductor Process Materials/Gases/Chemicals Electronic chip packaging and te

2024-07-16 AEM

Microchip MPU designed for autonomous space computing

Microchip MPU designed for autonomous space computing

The world has changed dramatically in the two decades since the debut of what was then considered a trail-blazing space-grade processor used in NASA missions such as the comet-chasing Deep Impact spacecraft and Mars Curiosity rover vehicle.

Semiconductor / Electronic ChipElectronic Design Automation (EDA)

2024-07-16 Microchip Technology Inc.