Taiyo Advances Semiconductor packaging with 700-nm RDL Formation on 12-inch Wafers

Taiyo Holdings has pushed advanced packaging toward submicron interconnects, forming a three-layer RDL with 700-nm lines and vias on 12-inch wafers. Discover how its novel FPIM material and dual-damascene process could enable denser, higher-performance AI chips and next-generation devices globally.

Redefining storage as AI’s persistent memory layer

Redefining Storage as AI’s Persistent Memory Layer

New space economics reshape electronics design for scalable LEO constellations

Reusable launches and expanding LEO constellations are rewriting the rules of satellite electronics. Discover how engineers are balancing cost, radiation tolerance, power, thermal demands and performance—and why system resilience is replacing the traditional zero-failure design model at true scale.

MICROIP wins US$20M smart residential edge AI project in Taiwan

Three-year system integration project marks MICROIP's expansion from ASIC design into vertical Edge AI deployments.

Ceva, LG partner to advance UWB integration for auto and IoT SoCs

Combined baseband, software and RF technologies target faster development of UWB-enabled automotive, industrial and consumer chips.

Analog Devices to acquire Alif Semiconductor in US$1.35B edge AI deal

Analog Devices is set to acquire Alif Semiconductor for US$1.35 billion, combining ADI's analog expertise with Alif's AI-native processors. Discover how the deal could accelerate secure, low-power intelligence in industrial systems, robotics, healthcare, wearables and data infrastructure worldwide.

AI chip boom drives fabless revenue up 73%

AI is redrawing the global semiconductor landscape. The combined revenue of the world's top ten fabless IC design companies surged 73% year on year to more than US$141.45 billion in 2Q26, propelled by demand for GPUs, CPUs, ASICs and advanced interconnect products.

SGS launches white paper on EU requirements for 3-MCPD, 3-MCPDE and glycidyl esters

The white paper examines the European Commission's latest amendments affecting 3-monochloropropanediol (3-MCPD), 3-MCPD fatty acid esters (3-MCPDE) and glycidyl fatty acid esters (GE), and outlines the implications for manufacturers, importers, retailers and food testing laboratories.

TaipeiPLAS 2026: Exhibitors Showcase

A look at the products that exhibitors will present at TaipeiPLAS 2026. This Special Supplement aims to guide buyers in making the most from their visit at Taiwan's major event for plastics and rubber.

Flexing OEM expertise: Flex Auto’s edge in conveyor systems

Taiwan-based company Flex Auto does design, layout and installation of conveyors for food, cosmetics, and other industries

Cultured wheat solution ensures mold-free shelf life for baked goods - Corbion

Corbion expands natural mold inhibition portfolio with Verdad® Essence WH150

Appeals from the Shelf: Plastic Triggers Purchase Impulses

Innovative designs and an extraordinary haptics increase attention directly at the point of sale according to studies.