Telink Semiconductor unveils ML and AI TL-EdgeAI Platform

Telink Semiconductor has launched a new generation of highly integrated chips as well as an ML and AI platform based on these devices.

Microchip MPLAB compiler licenses simplify software management

Microchip's unified system accommodates evolving development needs and offers multiple tiers to suit growing teams.

imec achieves electrical yield for 20nm pitch metal lines with High-NA EUV single patterning

imec has presented the first electrical test results obtained on 20nm pitch metal line structures patterned after single-exposure High NA EUV lithography.

Keysight enhances portfolio of RF and Microwave Test Instruments

Keysight has launched six new analog signal generators, two vector signal generators, eight RF synthesizers, and three signal source analyzers.

ST NFC reader IC and modular kit accelerate contactless design development

ST's ST25R200 reader/writer IC makes it easier to explore creative applications for contactless NFC technology.

The race for humanoid robotics

As labor shortages and rising operational costs persist, global investments in robotics research and development (R&D) are accelerating.

Food texture market forecast to reach USD38.62 billion by 2032

Introspective Market Research launches Food Texture Market report forecasting the global texture market to reach a value of USD 38.62 billion by 2032, from $23.65 billion in 2023

The key to accessible nutrition

Expert panel weighs in as concern about food security highlights the urgency of accessible nutrition.

Outlook 2025: What do consumers want?

Interview with Christian Philippsen, Managing Director, BENEO Asia Pacific

Brenntag receives validation for its climate targets

Brenntag has concluded a comprehensive two-year process to inventory, evaluate and submit Science Based Targets for emissions reductions in line with the SBTi criteria.

High-performance ovens helping processors create prepared food perfection

The global ready-to-eat food market is expanding rapidly and using the right equipment, and the right process for your application/s has never been more important.

Syensqo achieves breakthrough in mechanical recycling of PVDC multilayer food packaging

Syensqo gives used food packaging a second life and advances recycling of PVDC within the polyolefin waste streams