BSE expands test and back-end portfolio through Asian OEM partnership

The agreement allows BSE to expand its tool offerings and support a broader range of customer needs across test and back-end manufacturing.

EV Group unveils high-throughput D2W metrology for chiplet and 3D integration

EVG's EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield.

Renesas launches ultra-low-power MCU with advanced security for smart devices

Renesas' RA4C1 offers ultra-low power consumption, advanced security features, abundant communication interfaces, and segment LCD support.

Sustainable cooling powers the future of data centers

As AI and high-performance computing drive massive data growth, data centers face rising heat challenges from advanced CPUs and GPUs. Traditional air cooling is no longer enough, pushing liquid cooling and other innovations to the forefront.

Synopsys boosts AI copilot to accelerate next-gen chip design

Synopsys is expanding its Synopsys.ai Copilot generative AI capabilities to speed up semiconductor design, tackle complex SoCs, and boost engineering productivity amid talent shortages. Building on its AI leadership in chip design, Synopsys integrates reinforcement learning and GenAI to cut workflows from days to hours.

From organized to optimized — How smart data unlocks the next era of AI-enhanced design

AI is reshaping electronic design workflows, but uneven adoption exposes gaps. Many teams still face fragmented tools, poor version control, and unreliable metadata, making IP reuse inefficient and limiting AI’s impact.

Top 5 wafer fab equipment leaders surge 20% in 2Q 2025

The top five chip fab equipment manufacturers' revenue grew by 20% YoY in 2Q 2025, driven by strong momentum in leading-edge processes, strong HBM and advanced packaging demand.

AMD deepens semiconductor roots with new Malaysian R&D hub

AMD has inaugurated its new state-of-the-art office and engineering lab facility in Penang, significantly expanding its presence in Malaysia.

IBIE 2025: GNT highlights plant-based EXBERRY® colors with rainbow concha cookies

GNT's plant-based EXBERRY® colors can be used in a variety of bakery and snacks.

Bühler wins at the China–Switzerland Business Awards

Bühler received three distinctions at the China-Switzerland Business Awards in Beijing: the Innovation Pioneer Award (Winner) for its Carat 920 megacasting die-casting solution, the Digital Transformation Award (Second Place) for its Bühler SmarT digital coffee roasting management solutions, and the Legacy recognizing sustained industrial excellence and a 165-year legacy of innovation.

Avoiding dietary supplement labeling compliance pitfalls for US markets webinar

SGS will hold the webinar: Avoid FDA/FTC Compliance Pitfalls: Labeling Strategies for Dietary Supplements’, on September 16, 2025.

Halal Expo Istanbul 2025 & World Halal Summit: Global Halal Industry to Gather in Istanbul