Kennametal delivers end-to-end machining solutions for automotive manufacturers

Kennametal combines turning, milling and holemaking tools with digital machining, engineering support and scrap recycling services—helping automotive suppliers improve productivity, solve application challenges and strengthen profitability.

Prima Power 3D laser systems address complex automotive manufacturing needs

Prima Power’s five-axis 3D laser systems help automotive manufacturers cut, weld and drill complex components with precision. Integrated automation and intelligent software support consistent quality, higher throughput and fewer secondary operations.

Ceratizit digital twin enhances automotive machining efficiency

Ceratizit’s Visual Twin lets automotive manufacturers test machining strategies virtually—helping identify problems before production, reduce scrap and tool changes, conserve materials, and improve machine utilization.

Laserax takes a majority stake in Germany-based SLCR Lasertechnik

The strategic partnership strengthens Laserax's position as a global leader in industrial laser solutions, expands its manufacturing footprint and gives customers access to some of the industry's most advanced laser solutions.

Kerry to share innovative concepts and strategic insights at Fi Asia Indonesia

At Stand D1A06 [Hall 1], Kerry features innovation across dairy, beverages, meat, savory flavors, and digestive health. The company will also host five technical seminars on September 16 and 17.

Prosur showcases clean-label solutions for Asia’s “new food rules”

Prosur will showcase its natural ingredient solutions at FI Asia, demonstrating how manufacturers can “protect food with food” to meet growing demand for cleaner labels in Asia.

Southeast Asia advances food reformulation through policy and consumer demand

Fi Asia Indonesia 2026 offers a platform to discover the latest ingredients, technologies, and formulation solutions. The event takes place from September 16-18, 2026 at the JIExpo, Jakarta.

Taiyo Advances Semiconductor packaging with 700-nm RDL Formation on 12-inch Wafers

Taiyo Holdings has pushed advanced packaging toward submicron interconnects, forming a three-layer RDL with 700-nm lines and vias on 12-inch wafers. Discover how its novel FPIM material and dual-damascene process could enable denser, higher-performance AI chips and next-generation devices globally.

Redefining storage as AI’s persistent memory layer

Redefining Storage as AI’s Persistent Memory Layer

New space economics reshape electronics design for scalable LEO constellations

Reusable launches and expanding LEO constellations are rewriting the rules of satellite electronics. Discover how engineers are balancing cost, radiation tolerance, power, thermal demands and performance—and why system resilience is replacing the traditional zero-failure design model at true scale.

MICROIP wins US$20M smart residential edge AI project in Taiwan

Three-year system integration project marks MICROIP's expansion from ASIC design into vertical Edge AI deployments.

Ceva, LG partner to advance UWB integration for auto and IoT SoCs

Combined baseband, software and RF technologies target faster development of UWB-enabled automotive, industrial and consumer chips.