Micro machines with major impact as autonomous microrobots enter real-world use

Researchers have overcome long-standing barriers in robotics to create autonomous micro-robots that combine computing, sensors, power and movement in tiny, untethered systems.

PreForm’s smart tools turn CAD models into print-ready parts

Discover how the new PreForm 3.54 software from Formlabs streamlines 3D printing prep from design to production.

Exxelia develops smart integrated magnetics for space-grade power systems

Exxelia has developed a custom Smart Integrated Magnetics solution for space-grade power conditioning and distribution units (PCDUs)

Efficient precision for medical products: WITTMANN Group at PLASTINDIA 2026

Smart savings are the focus at the WITTMANN Group's stand at PLASTINDIA from February 5 to 10 in New Delhi.

Driving the next generation of metal forming through digital intelligence

The global manufacturing industry is undergoing a profound transformation as digitalisation, data intelligence, and simulation technologies redefine how products are designed and produced.

Norbert Jungreithmayr of WFL Millturn reflects on two decades of innovation

In an era defined by rapid technological progress and shifting market dynamics, few leaders can claim the kind of enduring impact that Norbert Jungreithmayr has had on the machining industry.

Digitalisation and AI integration lift Singapore’s digital economy to 18.6% of GDP

Digitalisation is essential to the growth of Singapore's overall economy. In 2024, Singapore's digital economy grew by S$12 billion[1], expanding to a total of S$128.1 billion.

SEMIFIVE wins AI Chip design projects in Japan

Demonstrates end-to-end expertise in high-performance custom chip design for AI and HPC

Memory Price Surge Hits Game Console Shipments

Memory Price Surge Squeezes Game Console Margins; 2026 Shipment Forecast Revised Downward, Says TrendForce

Powering AI’s Next Leap: AP Technology expands S-SiCap™ applications

The S-SiCapTM product line covers two types: Discrete Devices and InterPoser with silicon Capacitor (IPC), which correspond to different system architectures and application scenarios to meet diverse design needs

Certus taps AI to fast-track analog and ESD IP

Siemens announced that Certus Semiconductor has adopted Solido to accelerate IO library, ESD and analog IP development for automotive, aerospace, AI and IoT applications.

CHINAPLAS 2026: Quality Growth Driven by Technology, Thriving Future Powered by Green Solutions

CHINAPLAS 2026 is expected to span over 390,000 square meters across 16 exhibition halls, and bring together more than 4,600 exhibitors from around the world to showcase breakthroughs in new materials, intelligent innovations and green transformations.