Samsung commences mass production of PCIe 6.0-based eSSD

Samsung's latest eSSD features 9th-generation V-NAND, 4nm controller and liquid-cooling optimization to support demanding AI workloads.

Longsys reaches 1M monthly mSSD output to support expanding edge AI storage demand

The company scales manufacturing of SiP-based Micro SSDs as demand grows for compact, high-performance storage in AI PCs and intelligent edge devices.

Applied Materials expands Singapore manufacturing to support AI chip demand

New state-of-the-art facility strengthens Applied’s global manufacturing and R&D capabilities to drive resilience and scalability

Electronic system design industry revenue up 13% in 1Q 2026

The electronic design automation industry continued to report strong year-over-year revenue growth in 1Q 2026.

AI Is fueling Lintes' next growth phase—and its biggest product push yet

Lintes Technology is accelerating its AI strategy with next-generation high-speed interconnect solutions and expanded automated manufacturing

See More, Compute Less: ST's new 3D LiDAR targets the next wave of edge AI

STMicroelectronics has launched the VL53L9, its first direct Time-of-Flight 3D LiDAR module, bringing high-resolution depth sensing to compact edge AI systems.

AI boom drives memory fab spending past the $50 billion mark

The AI infrastructure boom is set to push global 300mm memory fab equipment investment past US$50 billion for the first time in 2026, according to SEMI.

Can hands-on ai labs speed up enterprise adoption?

Arrow Electronics has launched Global Experience Centers to help customers and channel partners turn AI ambitions into real-world deployments. Located in the US and Sweden, the facilities provide hands-on environments for testing AI, cloud and cybersecurity solutions, conducting proof-of-concept projects and validating multivendor architectures before investment—helping reduce risk and accelerate enterprise AI adoption.

SK keyfoundry advances auto chip reliability with new on-chip EMC protection technology

SK keyfoundry has developed a Bi-SCR-based on-chip EMC protection technology that improves the reliability of automotive semiconductors under harsh electrical conditions.

IBM breaks the 1nm barrier with next-generation chip architecture

IBM has unveiled what it says is the world's first sub-1 nanometer chip technology, introducing a new 3D nanostack architecture that packs nearly 100 billion transistors into a fingernail-sized chip.

Barentz brings protein, fiber, flavor and nutrition innovations to Foodpro 2026

Visitors to Foodpro in Melbourne are invited to meet the Barentz team at stand H8 to discuss market needs, explore application concepts and learn more about the company’s ingredient solutions and technical capabilities for the Australian food market.

GOOD NatureRelax: New ingredient for dough relaxation

With GOOD NatureRelax, GoodMills Innovation offers a clean-label baking ingredient based on wheat germ that counteracts excessive dough elasticity – naturally and without additives.