South Edition: Tube & Pipe Fair 2026 Is Bigger, Better and Even More Business Focused!
2026-05-07 Tube & Pipe Fair 2026
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South Edition: Tube & Pipe Fair 2026 Is Bigger, Better and Even More Business Focused!
2026-05-07 Tube & Pipe Fair 2026

SK Group signs MOUs to advance Vietnam’s AI ecosystem and infrastructure development
SK Group will collaborate with Vietnam to develop the country’s AI ecosystem and infrastructure.
2026-05-06 SK Group

TSMC launches A13 process and advanced technologies
A13 maintains full backward compatibility with A14 design rules, enabling faster customer migration to the company’s nanosheet transistor architecture.
2026-05-06 Taiwan Semiconductor Manufacturing Co. Ltd (TSMC)

ATLANT 3D and NUS partner on AI-driven materials discovery foundry in Singapore
ATLANT 3D and NUS I-FIM are collaborating to build AI-driven, atomic-scale materials discovery foundry in Singapore.
2026-05-06 ATLANT 3D

Southeast Asia emerges as global data center hotspot as market set to hit US$14B by 2034
The Southeast Asia data center market is forecast to grow to US$14 billion by 2034, driven by cloud adoption amid exploding AI demand.
2026-05-06 IMARC Group

AI Chip boom powers double-digit growth in global electronic system design industry
ESD industry revenue increased by 10.3% year-on-year to $5.47 billion in the fourth quarter of 2025, according to the ESD Alliance.
2026-05-06 SEMI

AI infrastructure boom fuels rapid growth of the ‘Foundry 2.0’ semiconductor ecosystem
The broadly defined Foundry 2.0 market is projected to surpass $360 billion in 2026, representing 17% YoY growth, according to IDC.
2026-05-06 International Data Corp.

Polyn Technology drives ultra-low-power automotive ai forward with neuromorphic chip tapeout
Polyn Technology has taped out a VibroSense engineering chip featuring an analog neuromorphic core for tire friction monitoring.
2026-05-06 Polyn Technology

JEDEC pushes DDR5 memory performance to new heights with next-generation MRDIMM standards
The new DDR5 MRDIMM memory logic standards enable higher bandwidth scaling while JEDEC progresses next‑generation MRDIMM module designs.
2026-05-06 JEDEC Solid State Technology Association

GUC powers the next wave of AI Computing with advanced ASIC and chiplet technologies
Collaboration brings together flagship SoC design, optical I/O and rack-scale liquid-cooled system integration to help hyperscalers accelerate system-ready AI infrastructure.
2026-05-06 Global Unichip Corp. (GUC)

Arrow Electronics accelerates shift toward software-defined vehicles with new E/E architecture initiative
Arrow Electronics is positioning itself as a key enabler of next-generation mobility.
2026-05-06 Arrow Electronics

Analog Devices expands semiconductor manufacturing network with new Thailand facility
Thailand plays a critical role in ADI's global manufacturing network, supporting long‑term growth by expanding the company's footprint with the resilience, flexibility and scale needed to serve customers across several markets.
2026-05-06
Longsys reaches 1M monthly mSSD output to support expanding edge AI storage demand
Applied Materials expands Singapore manufacturing to support AI chip demand
Electronic system design industry revenue up 13% in 1Q 2026
Can hands-on ai labs speed up enterprise adoption?
2026-07-16
IBM breaks the 1nm barrier with next-generation chip architecture
2026-07-16
Compounds for high-power, high-voltage power modules
2026-07-14
Adaptive drilling control for smarter deep-hole machining
2026-07-14
A compact clamp for high-precision machining in confined spaces
2026-07-14