SEMIFIVE wins AI Chip design projects in Japan

Demonstrates end-to-end expertise in high-performance custom chip design for AI and HPC

Memory Price Surge Hits Game Console Shipments

Memory Price Surge Squeezes Game Console Margins; 2026 Shipment Forecast Revised Downward, Says TrendForce

Powering AI’s Next Leap: AP Technology expands S-SiCap™ applications

The S-SiCapTM product line covers two types: Discrete Devices and InterPoser with silicon Capacitor (IPC), which correspond to different system architectures and application scenarios to meet diverse design needs

Certus taps AI to fast-track analog and ESD IP

Siemens announced that Certus Semiconductor has adopted Solido to accelerate IO library, ESD and analog IP development for automotive, aerospace, AI and IoT applications.

CHINAPLAS 2026: Quality Growth Driven by Technology, Thriving Future Powered by Green Solutions

CHINAPLAS 2026 is expected to span over 390,000 square meters across 16 exhibition halls, and bring together more than 4,600 exhibitors from around the world to showcase breakthroughs in new materials, intelligent innovations and green transformations.

Shibaura: Expansion into European market

Dr. Georg Holzinger, Managing Executive Officer of Shibaura Machine and future CEO and President of Shibaura Machine LWB GmbH shared the company's latest development at K 2025

First Mold to integrate AI agents in CNC machining management

First Mold’s AI integration targets five key areas that directly enhance efficiency and customer satisfaction.

Burcon pea and sunflower proteins outperform in plant-based cheese study

Burcon's Peazazz®C pea protein and Solatein™ sunflower protein do well in a study conducted by the University of Guelph in Canada.

Precision redefined for microtool measurement

A new milestone in microtool measurement has arrived with the LC54-DIGILOG, Blum-Novotest’s most compact and advanced laser system. Designed for ultra-small tools, it delivers exceptional precision, stability, and functionality in a space-saving format, marking a major step forward for next-generation micro-machining.

Small Wins and Big Transformations: What’s reshaping the industry

The industrial sector is entering a major turning point as greener, smarter manufacturing becomes essential. AI, robotics, and sustainable innovation are now reshaping real production practices. In this interview, Jacek Smoluch of Mitsubishi Electric explores the latest trends, challenges, and regulatory pressures defining 2025.

Polyvantis: Advanced thermoplastic solutions

Polyvantis offers one of the most comprehensive portfolios in the industry, serving global customers with trusted brands including EUROPLEX®, LEXAN™ polycarbonate (PC) film and sheet, and PLEXIGLAS® polymethylmethacrylate (PMMA) semi-finished products.

Chyi Yang: Multi-layer co-extrusion blown film lines

Chyi Yang Industrial Co., Ltd. successfully promoted its latest generation of multi-layer co-extrusion blown film lines in 3-, 5-, and 7-layer configurations last October at K 2025